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2021/02/15

< Product > Lead-Free Solder Paste for Formic Acid Reflow

Highly acclaimed in terms of solder jointing on power devices

In the manufacture of power semiconductors die attach in a formic acid atmosphere is being used increasingly because of the reduced incidence of voids in the solder joint. Voids reduce the heat transfer capacity of the solder joints, which can result in overheating of the die. SN100C P900 D2 solder paste has been formulated to deliver optimum performance in a formic acid atmosphere.

Significant void reduction!

X-ray transmission imaging

Void observation method

Ultra-low residual jointing is possible

Residue observation via the SEM-EDX analysis

Product application example of SN100C P900 D2 (power devices)

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For more information, check our [ Digital Catalogue ].

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