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2021/02/15

< Product > High Reliability Lead-Free Solder Paste

High resistance to cracking

In recent years, lead-free solder materials have been required to have excellent thermal cycle resistance. Hard alloys are preferred because they become less deformed during thermal cycles, but due to their hardness, they cannot absorb forces such as impacts, and the applied forces can apply damage to the joint interface portions and components, causing cracks. LF-C2 has alloy characteristics with excellent heat cycle resistance by optimizing the balance of strength. It also reduces void generation, which is one of the issues of surface mounting.

LF-C2 has a higher shear strength than SAC305 and suppress the generation of cracks

Resistance to Crackng

No cracking after 2000 cycles

Shear strength retention

2000 cycles: Higher strength retention!

Significant void reduction!

Incidence of voiding

Significant void reduction!
Observation method : X-ray transmission imaging at solder joints
Test component (left) : R3216
Test component (right) : QFP (10 mm) thermal land

Melting point comparison

Peak reflow temperature lower than SAC305.

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For more information, check our [ Digital Catalogue ].

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