WORKING WITH LOW TEMPEATURE SOLDERS
“SMTA international 2019” held from September 22 to 26 in Rosemont, Illinois, USA.
During this conference and exhibition a panel discussion on the topic “WORKING WITH LOW TEMPERATURE SOLDER” was held on the GLOBAL SMT & PACKAGING booth.
In the global electronic industry “low temperature soldering” is an issue attracting a lot of attention and many of the exhibitors at SMTAI 2019 were displaying materials and equipment formulated and designed for its implementation.
Nihon Superior was represented on the panel by Keith Sweatman. You can access a video of this panel discussion on the GLOBAL SMT & PACKAGING website.