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2019/07/11

Introduction of the latest article on Low-Temperature Soldering

Defective soldering occurs due to PCB warpage caused by heat during the reflow process.
Or how can thermal damage to components or laminated parts be minimized ?

The electronics industry is now facing these issues.

The simplest solution to these issues is to use a low-temperature solder.
The heat-related issues can be solved by using a Sn-Bi alloy which has a relatively low melting point of 139℃. However, this alloy poses the risk of another problem in that it fails to ensure the quality of solder joints at a required level because of its brittleness.

” Are there any good alternatives ? “

The article”Optimizing solder Paste Volume for Low-temperature Reflow of BGA Packages” published in 「SMT007 MAGAZINE」 (July 2019 edition) is currently receiving a lot of attention.

We hope this article will provide you with information that is useful for finding a solution.

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