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2018/07/31

< Product > NS-F851 Wave Soldering Flux

Good barrel fill and topside fillet formation

NS-F851 is flux for lead-free wave soldering. It facilitates solder drainage and ensures minimum bridges, thus providing secure mounting in wave soldering. Additionally, this flux allows excellent wetting and reliable solder joints.

Comparison of Wetting and Barrel Fill

Comparison with conventional flux in solder rise in IC DIP package and CN connector. Good barrel fill and topside fillet formation.

IC DIP soldering conditions

Preheat Temperature 105-115°C
Peak Temperature 245-250°C

CN Tidley Connector

Preheat Temperature 110-120°C
Peak Temperature 245-250°C

Excellent Through-hole Fill / Excellent Solder Drainage

Sustained activity of NS-F851 ensures a low incidence of bridging.

Appearance of solder joints

Red circles show points where bridges occurred.

Probability of bridge occurrence

(Left) Preheat Temperature 105-115°C
    Peak Temperature 245-250°C
(Right) Preheat Temperature 110-120°C
    Peak Temperature 245-250°C

NS-F851 works well with Sn-Ag-Cu solder (SAC305) and Sn-Cu-Ni solder (SN100C) Wave soldering lines running either type of alloy can be converted to NS-F851 with minimal inconvenience compared with an alloy change.

For more information check our [ Digital Catalogue ] (English version coming soon)

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