Technical Information

Presented Paper

2012

Title Presented at Download
Pushing the Limits of Lead-Free Soldering Pan Pacific Microelectronics Symposium
As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs
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The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints Pan Pacific Microelectronics Symposium
As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs
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Tin-Copper-Nickel-Germanium, A Case Study in Lead-Free Implementation Pan Pacific Microelectronics Symposium
As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs
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2011

Title Presented at Download
The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders SMTAI 2011 Technical Sessions
As originally published in the SMTA International 2011 Conference Proceedings.
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The Investigation of an Improved Tin-Zinc Solder for Practical Use International Conference on Electronics Packaging (ICEP) 2011
Japan Institute of Electronics Packaging (JIEP)
IEEE, CPMT Society Japan Chapter
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2009

Title Presented at Download
Inhibition of Cracking in Cu6Sn5 intermetallic Compound at Sn-Cu Lead-Free Solders and Cu Substrate Interfaces International Conference on Electronics Packaging (ICEP) 2009
Japan Institute of Electronics Packaging (JIEP)
IEEE, CPMT Society Japan Chapter
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2005~2008

Title Presented at Download
Reliability Testing of Ni-Modified Sn Cu and SAC305 ? Vibration SMTA International 2008 Download
Relationships Between the Impact Strength and Microstructure of Lead-Free Solders International Conference on Soldering and Reliability Download
Lead-Free Solder Formulation: You need tin, but do you need silver ? ITRI Ltd’s and Metal Events Ltd’s International Tin Conference Download
Properties That are Important in Lead-Free Solders APEX 2008 Download
Accelerated Reliability Testing of Ni-Modified SnCu and SAC305 IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead -Free Electronics Download
Strength of Lead-Free BGA Spheres in High Speed Shear Loading Pan Pacific Microelectronics Symposium
As originally published in the 2008 Pan Pacific Microelectronics Symposium Conference Proceedings.
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Impact Strength of Lead-free BGA Spheres IPC/JEDEC Global Conference on Lead Free Reliability and Reliability Testing for RoHS Lead Free Electronics (2007) Download
The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys Journal of ELECTRONIC MATERIALS
(DOI: 10.1007/s1 1664-007-0248-8) (2007)
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The Influence of 0-0.1wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi Journal of ELECTRONIC MATERIALS
(DOI: 10.1007/s1 1664-007-0281-7) (2007)
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High Reliability Lead-free Solder SN100C (Sn-0.7Cu-0.05Ni+Ge) IPC WORKS ASIA 2007 Download
Measuring the True Wetting Time of Solders APEX 2007 Download
Reliability of Tin/Copper/Nickel Lead-Free Wave Solderings IPC/JEDEC International Conference on Lead Free Electronics Components and Assemblies- “RoHS Compliance and Beyond” (2006) Download
The Advantages of The Ni-modified Sn-Cu Eutectic Solder as a Lead-free Hot Air Leveled Printed Circuit Board Finish TPCA Exhibition & Conference (2006) Download
Solidification Behaviour of Lead-Free Alloys and its Relationships to Their Performance as Practical Solders SMTA International Conference (2006) Download
A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu Scripta MATERIALIA 2006 Download
Advances in the Understanding of the Behaviour of the Ni-Modified Sn-Cu Eutectic as a Lead-free Solder International Conference on Lead Free Soldering (2006) Download
Solidification Behaviour of the Ni-modified Sn-0.7Cu Eutectic IPC/Soldertec 4th International Conference on Lead Free Electronics (2006) Download
The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead-free Solder APEX 2006 Download
Microstructure Control in Sn-0.7mass % Cu Alloys Materials Transactions Vol.46, No.11 (2005) Download
An Alternative Lead Free Electronics Assembly Technology IPC/JEDEC 9th International Conference on Lead Free (2005) Download
Developments in the Understanding of the Ni-modified Sn-Cu Eutectic as the Basis for a Reliable Lead-free Solder Brasage 2005 Download
A Database for the Transition to Lead-free IPC/JEDEC 3rd International Conference on Lead Free Electronics “Towards the RoHS Directive“ (2005) Download
A Eutectic Alloy for Lead-free Soldering International Conference on Lead Free Soldering (2005) Download
The Effect of Ni on the Microstructure and Behaviour of the Sn-Cu Eutectic Lead-free Solder APEX 2005 Download

Technical.Info

Presented Paper

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