Lead-Free Solder

Solder Paste (Printing Grade)

SN100C P504 D4

Improved wettability

SN100C P504 D4 is Nihon Superior’s latest general purpose solder paste and is suitable for fine pitch applications.

Comparison of wetting at 3-Pin SOT-23

Left : Previous product
Right : SN100C P504 D4
Excellent reflow to the cut edge of the termination.

SN100C P506 D4

Enables usage and storage under various circumstances

SN100C P506 D4 is a lead-free (Sn-Cu-Ni-Ge), no-clean solder paste that can be stored at room temperature for more than 60 days without deterioration. This new material will not only simplify stock management, but also improve productivity with excellent consecutive printability.

Consecutive Printability Test (8 hours per day in 1 week)

Good printability and stability of viscosity maintained during continuous printing.

SN100C P520 D5

Lead-Free Solder Paste for 01005 (0402 metric) Chip Components

High reliability lead-free solder paste optimized to deliver good reflow with chip components down to 0402 metric. SN100C P520 D5 improves the joint quality of densely populated boards with filletless, small solder volume chip components and fine pitch mounting in which a reduction in joint strength is a concern due to the very small joint size.

Excellent Reflow

Left : 0402 chip
Right : Pad dia 0.15mm
Excellent reflow on very small pads

SN100C P604 D4

Achieved unconventional wetting for halogen-free solder paste

Rheology optimized for fast printing at low squeegee pressure. High tack and long abandon time (response to pause).
Flux activation system optimized for good wetting on substrates with marginal solderability.

Appearance of Solder Joints

Left : 3-Pin SOT-23
Right : Enlarged photo
Excellent reflow to the cut edge of the termination.

SN100C P800 D2

Lead-Free Solder Paste for Power Semiconductors

SN100C (SnCuNi+Ge) P800 D2 is a high reliability paste for device assembly that reduces voiding and reflow time.

X-ray Images of Voiding

Left : Previous product (Void area 11.3%)
Right : SN100C P800D2 (Void area 1.7%)
Approximately 80% reduction in void area

SN100C P810 D4

Specialially for reducing voiding

SN100C P810 D4 is low-voiding lead-free solder paste. When reflowed with SN100C P810 D4 large-area solder joints such as those between power semiconductors and their substrates have a lower incidence of voiding than if reflowed with conventional lead-free solder paste. While delivering low voiding this high reliability lead-free solder paste is also formulated to deliver excellent reflow with minimum mid-chip balling and exhibits excellent wetting on all common substrates.

Comparison of Void Area (X-Ray Image of Voiding)

Reduced voiding in each atmosphere compared to previous product.

SN100C P820 D5

No Flux Residue Lead-Free Solder Paste

Please contact sales department for more information about this product.

SN99CN P506 D4

Lead-Free Solder Paste / SN100C Advantage Series

Please contact sales department for more information about this product.

SN97C P504 D4

General Purpose Lead-Free Solder Paste / SAC305 Alloy

Please contact sales department for more information about this product.

SN97C P506 D4

General Purpose Lead-Free Solder Paste / SAC305 Alloy

Please contact sales department for more information about this product.

page top