Alconano Nano-Silver Paste (Die Bonding Nano Material)
Alconano Nano-Silver Paste is based on a patented technology that makes it possible to effectively join most metals as well as Si and SiC at low sintering temperatures, if necessary in nitrogen, without the nitrous or sulphurous residues that are the by-products of the sintering of conventional nano-silver pastes. The highly active surface of the nano-silver particles and the consequent strong capillary forces makes it possible to achieve strong bonds with high electrical and thermal conductivity at low temperature without the need for external pressure.
・Wide Range of Viscosities Available
・High Silver Content (80-90%)
・Wide Sintering Temperature Range (200-350℃)
・Low Electrical Resistivity
・High Thermal Conductivity
・High Bond Strength