SMTA International 2018
Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth #511 at the SMTI International 2018, scheduled to take place Oct.14-18, 2018 at the Donald Stephens Convention Center.
The company will introduce the new Flux-Cored wire, SN100CV P608 D4 solder paste, and NS-F851 rosin-based flux.
Improved Flux-Cored Solder Wire
The newly developed (032) is a general purpose, no-clean, halogen-free cored-flux. When paired with the SN100C® lead-free alloy, it provides fast wetting and excellent solder joints, not only on copper (Cu) but also nickel (Ni) substrates. SN100C (032) is a good match for continuous robotic soldering due to the fast wetting and low spattering. (032) cored-flux is available with the company’s new SN100CVTM lead-free alloy that gains its strength from solute atoms in the tin matrix as well as SAC305 solder.
Halogen-Free Solder Paste
SN100CV P608 D4 is a completely halogen free, lead-free, no-clean solder paste. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. The paste provides excellent wetting and reduces voiding.
The company also plans to introduce NS-F851 – the improved version of the NS-F850 rosin-based flux for lead-free wave soldering. The new, no-clean flux ensures excellent wetting of all PCB and component substrates to deliver maximum through-hole fill and facilitates the solder drainage that ensures minimum bridges and icicles. It is the ideal flux for lead-free wave soldering. Additionally, the rosin-based flux ensures that the full reliability potential of SN100C lead-free solder is realized.
For more information about Nihon Superior’s new products, meet company representatives in Booth #511 at the show.
|Show Dates||2018 Oct.16-17|
|Hall||Donald Stephens Convention Center|
|Location||5555 N River Rd, Rosemont, IL 60018|