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Exhibitions

2018/08/31

SMTA International 2018

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Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth #511 at the SMTI International 2018, scheduled to take place Oct.14-18, 2018 at the Donald Stephens Convention Center.

The company will introduce the new Flux-Cored wire, SN100CV P608 D4 solder paste, and NS-F851 rosin-based flux.

Improved Flux-Cored Solder Wire

The newly developed (032) is a general purpose, no-clean, halogen-free cored-flux. When paired with the SN100C® lead-free alloy, it provides fast wetting and excellent solder joints, not only on copper (Cu) but also nickel (Ni) substrates. SN100C (032) is a good match for continuous robotic soldering due to the fast wetting and low spattering. (032) cored-flux is available with the company’s new SN100CVTM lead-free alloy that gains its strength from solute atoms in the tin matrix as well as SAC305 solder.

Halogen-Free Solder Paste

SN100CV P608 D4 is a completely halogen free, lead-free, no-clean solder paste. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. The paste provides excellent wetting and reduces voiding.

Rosin-Based Flux

The company also plans to introduce NS-F851 – the improved version of the NS-F850 rosin-based flux for lead-free wave soldering. The new, no-clean flux ensures excellent wetting of all PCB and component substrates to deliver maximum through-hole fill and facilitates the solder drainage that ensures minimum bridges and icicles. It is the ideal flux for lead-free wave soldering. Additionally, the rosin-based flux ensures that the full reliability potential of SN100C lead-free solder is realized.

For more information about Nihon Superior’s new products, meet company representatives in Booth #511 at the show.

Show Dates 2018 Oct.16-17
Hall Donald Stephens Convention Center
Booth #511
Location 5555 N River Rd, Rosemont, IL 60018

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