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Exhibitions

2018/08/08

NEPCON SOUTH CHINA 2018

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Nihon Superior Co. Ltd will exhibit in Booth 1G08 at NEPCON South china, scheduled to take place Aug. 28-30, 2018 at the Shenzhen convention & Exhibition Center in Shenzhen-City, China.

The company will introduce the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.

SN100CVTM P608 D4 is a completely halogen free, lead-free, no-clean solder paste. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. The paste provides excellent wetting and reduces voiding.

The company also plans to introduce NS-F851 – the improved version of the NS-F850 rosin-based flux for lead-free wave soldering. The new, no-clean flux ensures excellent wetting of all PCB and component substrates to deliver maximum through-hole fill and facilitates the solder drainage that ensures minimum bridges and icicles. It is the ideal flux for lead-free wave soldering. Additionally, the rosin-based flux ensures that the full reliability potential of SN100C lead-free solder is realized.

ALUSAC-35 is a lead-free alloy designed for soldering aluminum. Despite the cost and the performance advantages of aluminum, its commercial adoption has been slow because of the concern about the galvanic corrosion that results from differences in the electrical potential of the constituent phases. Joints to aluminum made with this new alloy retain reasonable strength even after 30 days of saltwater immersion.

For more information about Nihon Superior’s new products, meet company representatives in Booth 1G08 at the show.

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Show Dates 2017 Aug.28-30
Hall Shenzhen convention & Exhibition Center
Booth 1G08
Location Fuhua Third Road, Futian Central District, Shenzhen, China

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