论文发表
2012
| 标题 | 发布 | Download |
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| Pushing the Limits of Lead-Free Soldering | Pan Pacific Microelectronics Symposium As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs |
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| The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints | Pan Pacific Microelectronics Symposium As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs |
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| Tin-Copper-Nickel-Germanium, A Case Study in Lead-Free Implementation | Pan Pacific Microelectronics Symposium As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs |
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2011
| 标题 | 发布 | Download |
|---|---|---|
| The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders | SMTAI 2011 Technical Sessions As originally published in the SMTA International 2011 Conference Proceedings. |
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| The Investigation of an Improved Tin-Zinc Solder for Practical Use | International Conference on Electronics Packaging (ICEP) 2011 Japan Institute of Electronics Packaging (JIEP) IEEE, CPMT Society Japan Chapter |
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2009
| 标题 | 发布 | Download |
|---|---|---|
| Inhibition of Cracking in Cu6Sn5 intermetallic Compound at Sn-Cu Lead-Free Solders and Cu Substrate Interfaces | International Conference on Electronics Packaging (ICEP) 2009 Japan Institute of Electronics Packaging (JIEP) IEEE, CPMT Society Japan Chapter |
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